Composite spring structure to reinforce mechanical robustness of a MEMS device
Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partial...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
28.05.2024
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Subjects | |
Online Access | Get full text |
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