Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device

• Main Authors: Li, Jeng-Ting, Lin, Pu-Ju, Ko, Cheng-Ta, Kuo, Chi-Hai
• Format: Patent
• Language: English
• Published: 09.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A light emitting diode (LED) package structure includes a glass substrate, conductive through holes, active elements, an insulating layer, LEDs and pads. The glass substrate has an upper surface and a lower surface. The conductive through holes penetrate the glass substrate and connect the upper and...