Type III-V semiconductor substrate with monolithically integrated capacitor
A semiconductor die includes a barrier layer of type III-V semiconductor material, a channel layer of type III-V semiconductor material disposed below the barrier layer, the channel layer forming a heterojunction with the barrier layer such that a two-dimensional charge carrier gas is disposed in th...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
27.02.2024
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Subjects | |
Online Access | Get full text |
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