Semiconductor device package assemblies with direct leadframe attachment
In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed o...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
13.02.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive. |
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| AbstractList | In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive. |
| Author | Im, Seungwon Jeon, Oseob |
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| Notes | Application Number: US201916680795 |
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| RelatedCompanies | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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| Snippet | In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor device package assemblies with direct leadframe attachment |
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