Semiconductor package structure having substrate with embedded electronic component and conductive pillars

• Main Authors: Essig, Kay Stefan, Yen, You-Lung, Appelt, Bernd Karl
• Format: Patent
• Language: English
• Published: 23.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first package and a second package. The first package includes a first substrate, an electronic component, a trace layer, and a first conduc...