Electroplated indium bump stacks for cryogenic electronics
A cryogenic under bump metallization (UBM) stack includes an adhesion and barrier layer and a conductive pillar on the adhesion and barrier layer. The conductive pillar functions as a solder wetting layer of the UBM stack and has a thickness. An indium superconducting solder bump is on the conductiv...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.01.2024
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Subjects | |
Online Access | Get full text |
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