Chemical mechanical polishing pad and polishing method
CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprisi...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.11.2023
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Subjects | |
Online Access | Get full text |
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