Pressure sensing device with cavity and related methods
A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
07.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry. |
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Bibliography: | Application Number: US202017063147 |