Ultraviolet radiation shield layer
A method is provided to fabricate a wafer including a bonding layer interposed between a device wafer and a handle wafer. The method includes performing a first deposition process to deposit an ultraviolet (UV) shield layer on a backside surface of the handle wafer. A second deposition process is pe...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
17.10.2023
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Subjects | |
Online Access | Get full text |
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