Polyamide-imide resin film

• Main Authors: Eom, Youngsik, Kim, Sanggon, Yu, Yunah, Kim, Byungguk, Choi, Hyungsam
• Format: Patent
• Language: English
• Published: 09.08.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to a polyamide-imide resin film having a low birefringence index, including: a polyamide-imide block copolymer containing an amide repeating unit to which an isophthaloyl group and an aromatic diamine residue are bonded; an imide repeating unit; and a trivalent function...