Multi-layer embedded magnetic inductor coil

A microelectronics package comprises a substrate that comprises a dielectric and at least two conductor layers within the dielectric, and an inductor structure having a magnetic core at least partially within the dielectric and extending at least between a first conductor layer and a second conducto...

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Bibliographic Details
Main Authors Do, Huong, Radhakrishnan, Kaladhar, Deng, Yikang, Bharath, Krishna, Alur, Amruthavalli P
Format Patent
LanguageEnglish
Published 02.08.2022
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