Multi-layer embedded magnetic inductor coil
A microelectronics package comprises a substrate that comprises a dielectric and at least two conductor layers within the dielectric, and an inductor structure having a magnetic core at least partially within the dielectric and extending at least between a first conductor layer and a second conducto...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
02.08.2022
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Subjects | |
Online Access | Get full text |
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