Memory chip having on-die mirroring function and method for testing the same
A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting th...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
26.07.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, tire package test, tire module test or the mounting test is failed. |
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| AbstractList | A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, tire package test, tire module test or the mounting test is failed. |
| Author | Lee, Hokyong Choi, Yongjoo Kim, Byoungsul Jung, Hwajin |
| Author_xml | – fullname: Jung, Hwajin – fullname: Lee, Hokyong – fullname: Kim, Byoungsul – fullname: Choi, Yongjoo |
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| Notes | Application Number: US202016867631 |
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| RelatedCompanies | SAMSUNG ELECTRONICS CO., LTD |
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| Snippet | A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test... |
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| Title | Memory chip having on-die mirroring function and method for testing the same |
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