Gas injection module, substrate processing apparatus, and method of fabricating semiconductor device using the same
A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second up...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
12.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes. |
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Bibliography: | Application Number: US202117159244 |