Thermoformed film compositions with enhanced toughness after thermoforming processes
Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) v...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
12.07.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2≥7.0−1.2×log (I2). |
---|---|
Bibliography: | Application Number: US201816647238 |