Thermoformed film compositions with enhanced toughness after thermoforming processes

Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) v...

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Bibliographic Details
Main Authors Perez, Carmelo Declet, Mazzola, Nicolas Cardoso, Perez Muñoz, Maria Laura, Hansen, Sydney E, Buaszczyk, Gianna, Gargalaka, Jr., João
Format Patent
LanguageEnglish
Published 12.07.2022
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Summary:Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2≥7.0−1.2×log (I2).
Bibliography:Application Number: US201816647238