Packaging unit, component packaging structure and preparation method thereof
A packaging unit, a component packaging structure and a preparation method thereof. The packaging unit includes a bonding substrate and spacers formed on the bonding substrate through a patterning process, wherein the bonding substrate is reserved with packaging regions for applying sealant. When th...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
07.06.2022
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Subjects | |
Online Access | Get full text |
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Abstract | A packaging unit, a component packaging structure and a preparation method thereof. The packaging unit includes a bonding substrate and spacers formed on the bonding substrate through a patterning process, wherein the bonding substrate is reserved with packaging regions for applying sealant. When the packaging unit is used to package a component, because the spacer(s) is supported between the bonding substrate and the base substrate, the packaging unit is easy to separate from the base substrate At the same time, the packaging unit has little or no damage to the base substrate and elements formed on the base substrate, thus effectively protecting the performance of the base substrate and the elements on the base substrate. |
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AbstractList | A packaging unit, a component packaging structure and a preparation method thereof. The packaging unit includes a bonding substrate and spacers formed on the bonding substrate through a patterning process, wherein the bonding substrate is reserved with packaging regions for applying sealant. When the packaging unit is used to package a component, because the spacer(s) is supported between the bonding substrate and the base substrate, the packaging unit is easy to separate from the base substrate At the same time, the packaging unit has little or no damage to the base substrate and elements formed on the base substrate, thus effectively protecting the performance of the base substrate and the elements on the base substrate. |
Author | Li, Xian Yang, Yan Tian, Limin Zhou, Hailong Dong, Tingze |
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RelatedCompanies | BOE TECHNOLOGY GROUP CO., LTD BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD |
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Snippet | A packaging unit, a component packaging structure and a preparation method thereof. The packaging unit includes a bonding substrate and spacers formed on the... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Packaging unit, component packaging structure and preparation method thereof |
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