Implementing electronic enclosure cooling containment for concurrent maintenance actions

Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concur...

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Bibliographic Details
Main Authors Mann, Phillip V, Anderl, William James
Format Patent
LanguageEnglish
Published 10.05.2022
Subjects
BLASTING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
NON-POSITIVE DISPLACEMENT PUMPS
PHYSICS
POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS
PRINTED CIRCUITS
PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
WEAPONS
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Summary:Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.
Bibliography:Application Number: US201816125590