Stress mitigation in organic laminates
The substrate includes one or more bottom circuit (BC) layers disposed one upon another and one or more front circuit (FC) layers disposed one upon another. The FC layers are disposed on the BC layers. In some embodiments, there are one or more core layers disposed between the FC and BC layers.One o...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
26.04.2022
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Subjects | |
Online Access | Get full text |
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