TSV-less die stacking using plated pillars/through mold interconnect

• Main Authors: Liff, Shawna M, Elsherbini, Adel A, Saucedo, Joe R, Lopez, Albert S, Falcon, Javier A, Swan, Johanna M, Meyers, Preston T
• Format: Patent
• Language: English
• Published: 05.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of ea...