Semiconductor device packages and methods of manufacturing the same
A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which includes an exposed portion, is disposed on the carrier. The conductive structure is disposed between the carrier and the exposed portion of the a...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
29.03.2022
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Subjects | |
Online Access | Get full text |
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Abstract | A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which includes an exposed portion, is disposed on the carrier. The conductive structure is disposed between the carrier and the exposed portion of the antenna element. The conductive structure electrically connects the electronic component to the carrier. The carrier, the exposed portion of the antenna element, and the conductive structure define an air space to accommodate the electronic component and to space the electronic component apart from the conductive structure. |
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AbstractList | A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which includes an exposed portion, is disposed on the carrier. The conductive structure is disposed between the carrier and the exposed portion of the antenna element. The conductive structure electrically connects the electronic component to the carrier. The carrier, the exposed portion of the antenna element, and the conductive structure define an air space to accommodate the electronic component and to space the electronic component apart from the conductive structure. |
Author | Wu, I Hung Tseng, Chi Sheng |
Author_xml | – fullname: Wu, I Hung – fullname: Tseng, Chi Sheng |
BookMark | eNqNzDsOwjAQRVEXUPDbw7AAisQUoSUC0QfqaGQ_JxZ4HMU264eCBVDd5uiu1UKiYKXaDsGbKLaYHGeyeHsDmtg8eUAiFksBeYw2UXQUWIpjk8vsZaA8ghIHbNXS8Sth9-tG7a-Xe3s7YIo90ncGQe4fXVXVzemo9bnW_5gPsM00fw |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US11289433B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US11289433B23 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:22:06 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US11289433B23 |
Notes | Application Number: US202016740168 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220329&DB=EPODOC&CC=US&NR=11289433B2 |
ParticipantIDs | epo_espacenet_US11289433B2 |
PublicationCentury | 2000 |
PublicationDate | 20220329 |
PublicationDateYYYYMMDD | 2022-03-29 |
PublicationDate_xml | – month: 03 year: 2022 text: 20220329 day: 29 |
PublicationDecade | 2020 |
PublicationYear | 2022 |
RelatedCompanies | Advanced Semiconductor Engineering, Inc |
RelatedCompanies_xml | – name: Advanced Semiconductor Engineering, Inc |
Score | 3.3959522 |
Snippet | A semiconductor package structure includes a carrier, an antenna element, an electronic component, and a conductive structure. The antenna element, which... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Semiconductor device packages and methods of manufacturing the same |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220329&DB=EPODOC&locale=&CC=US&NR=11289433B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKeqbTkXnhQjSt-JsF9s-FKGXMYRdcKvsbTRLClOWjrXDv-85dXO-6FtIIJwknEuS830H4D6zhGrx7NF0XcXNdmYL03Nn3EyFxOO3WqnkBBTu9Z-6Sftlwic1eN9iYSqe0M-KHBE1aob6Xlb2erl7xIqq3MriQcyxK3_ujP3I2NyOLaoH7hlR4MfDQTQIjTD0k5HRf_UxrCCmcTtAc71HYTTx7MdvAaFSlr9dSucY9oc4my5PoKZ0Aw7DbeW1Bhz0Nh_e2NzoXnEK4Yjy2HNNBK35iklFOs5Q-g80CQVLtWTf5aALlmdskeo1gRYqFCLDKI8V6UKdwV0nHoddE6WZ_ix9mox2gtvnUNe5VhfAMpdn6H2k7RAfXNsTynEcYVvK9Swp09YlNP-ep_nf4BUc0TZSlpXlXUO9XK3VDbrdUtxW-_UFhf6HxQ |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbokbwqyZmb4u4D7c9LCZsEFQ2iAzDG1lpl6ihI2zEf99rBfFF35o2aa5t7q7X3u93ADeZQXnLzu501-W2bmUm1T13ZuspZXj8RitltgQKR_F9b2w9TexJBd43WBjFE_qpyBFRo2ao76Wy14vtI1aociuLW_qGXflDN_FDbR0dG7IeuKeFbb8zHISDQAsCfzzS4hcfrxWSadxso7necTAkVKHSa1uiUha_XUr3AHaHOJsoD6HCRR1qwabyWh32ovWHNzbXulccQTCSeey5kASt-ZIwLnWcoPQfaBIKkgpGvstBFyTPyDwVKwlaUChEgrc8UqRzfgzX3U4S9HSUZvqz9Ol4tBXcPIGqyAU_BZK5dobeh5mO5IOzPModx6GmwV3PYCxtNaD59zzN_wavoNZLov60_xg_n8G-3FKZcWV451Atlyt-gS64pJdq774ABE-Krw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Semiconductor+device+packages+and+methods+of+manufacturing+the+same&rft.inventor=Wu%2C+I+Hung&rft.inventor=Tseng%2C+Chi+Sheng&rft.date=2022-03-29&rft.externalDBID=B2&rft.externalDocID=US11289433B2 |