Semiconductor device package and method of manufacturing the same

• Main Authors: Yeh, Chang-Lin, Chen, Ming-Hung, Chen, Sheng-Yu, Yeh, Yung-I
• Format: Patent
• Language: English
• Published: 14.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the...