LED packaging unit, LED lamp comprising same, and method of the manufacture same

• Main Authors: Kang, Guoping, Rodinger, Tomas, Liu, Mingjian
• Format: Patent
• Language: English
• Published: 07.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

The present invention is concerned with an LED packaging unit, a manufacturing method for the same, and an LED lamp. The LED packaging unit has a common substrate, N number of red LED chips, M number of green LED chips and X number of blue LED chips. The N number of red LED chips, the M number of green LED chips and the X number of blue LED chips are arranged and packaged on a bottom surface of a recess of the common substrate. The red LED chips, the green LED chips and the blue LED chips are all monochromatic LED chips, with N, M, and X being integers greater than 1. The distances between any adjacent two red LED chips (or green LED chips or blue LED chips) are substantially consistent.