Method for co-packaging light engine chiplets on switch substrate

A method for co-packaging multiple light engines in a switch module is provided. The method includes providing a module substrate with a minimum lateral dimension no greater than 110 mm. The module substrate is configured with a first mounting site at a center region and a plurality of second mounti...

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Bibliographic Details
Main Authors Ding, Liang, Aboagye, Steve, Patterson, Mark, Coccioli, Roberto, Nagarajan, Radhakrishnan L
Format Patent
LanguageEnglish
Published 02.11.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MULTIPLEX COMMUNICATION
SEMICONDUCTOR DEVICES
TRANSMISSION
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Summary:A method for co-packaging multiple light engines in a switch module is provided. The method includes providing a module substrate with a minimum lateral dimension no greater than 110 mm. The module substrate is configured with a first mounting site at a center region and a plurality of second mounting sites distributed densely along the peripheral sides. The method includes disposing a main die with a switch processor chip at the first mounting site. The switch processor chip is configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. The method further includes mounting a plurality of chiplet dies respectively into the plurality of second mounting sites. Each chiplet die is configured to be a packaged light engine with a minimum lateral dimension to allow a maximum number of chiplet dies with <50 mm from the main die for extra-short-reach data interconnect.
Bibliography:Application Number: US202016894622