Method for forming hermetic seals in MEMS devices
A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one o...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.11.2021
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Subjects | |
Online Access | Get full text |
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