Method for routing bond wires in system in a package (SiP) devices

Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads...

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Bibliographic Details
Main Authors Frantz, Gene Alan, Murtuza, Masood, Dantu, Neeraj Kumar Reddy
Format Patent
LanguageEnglish
Published 26.10.2021
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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