Method for routing bond wires in system in a package (SiP) devices
Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
26.10.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database. |
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| AbstractList | Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database. |
| Author | Dantu, Neeraj Kumar Reddy Frantz, Gene Alan Murtuza, Masood |
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| Notes | Application Number: US201716335204 |
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| RelatedCompanies | OCTAVO SYSTEMS LLC |
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| Snippet | Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to... |
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| SubjectTerms | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
| Title | Method for routing bond wires in system in a package (SiP) devices |
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