Semiconductor device with a layered protection mechanism and associated systems, devices, and methods
A semiconductor device includes a first die; a second die attached over the first die; a metal enclosure directly contacting and extending between the first die and the second die, wherein the first metal enclosure is continuous and encircles a set of one or more internal interconnects, wherein the...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
07.09.2021
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Subjects | |
Online Access | Get full text |
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