Chip transferring method and the apparatus thereof

A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of e...

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Main Authors Hsieh, Min-Hsun, Kuo, De-Shan, Yang, Jhih-Yong, Lee, Chang-Lin
Format Patent
LanguageEnglish
Published 06.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of each of the plurality of chips; respectively calculating an average characteristic value of each of the plurality of blocks based on the characteristic values of the multiple chips of each of the plurality of blocks; and transferring the multiple chips of at least two blocks of the plurality of blocks with the average characteristic values within the same range to a second load-bearing structure.
AbstractList A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of each of the plurality of chips; respectively calculating an average characteristic value of each of the plurality of blocks based on the characteristic values of the multiple chips of each of the plurality of blocks; and transferring the multiple chips of at least two blocks of the plurality of blocks with the average characteristic values within the same range to a second load-bearing structure.
Author Kuo, De-Shan
Lee, Chang-Lin
Yang, Jhih-Yong
Hsieh, Min-Hsun
Author_xml – fullname: Hsieh, Min-Hsun
– fullname: Kuo, De-Shan
– fullname: Yang, Jhih-Yong
– fullname: Lee, Chang-Lin
BookMark eNrjYmDJy89L5WQwcs7ILFAoKUrMK05LLSrKzEtXyE0tychPUUjMS1EoyUhVSCwoSCxKLCktBvGKUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJfGiwoaGBqZmxmYWTkTExagDSii4T
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US11056368B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US11056368B23
IEDL.DBID EVB
IngestDate Fri Aug 16 05:58:11 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US11056368B23
Notes Application Number: US201916257886
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210706&DB=EPODOC&CC=US&NR=11056368B2
ParticipantIDs epo_espacenet_US11056368B2
PublicationCentury 2000
PublicationDate 20210706
PublicationDateYYYYMMDD 2021-07-06
PublicationDate_xml – month: 07
  year: 2021
  text: 20210706
  day: 06
PublicationDecade 2020
PublicationYear 2021
RelatedCompanies EPISTAR CORPORATION
RelatedCompanies_xml – name: EPISTAR CORPORATION
Score 3.3314505
Snippet A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Chip transferring method and the apparatus thereof
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210706&DB=EPODOC&locale=&CC=US&NR=11056368B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1JS8NAFH6UKupNq6J1YQTJLZhlmuUQhGwUoQu2kd7KJJmp9ZCEJsW_78yYWi96mwXeLPDmfTPz3vcAHlnuajhnukosDavYZanqYoeomQDjVHOdjInY4dHYGib4ZTFYdOBjFwsjeUI_JTki16iM63sjz-tq_4gVSt_K-ild86byOZ57odLejvn9xdYsJfS9aDoJJ4ESBF4yU8avni4yzJuW4_Pj-kDAaMGzH735Iiql-m1S4lM4nHJpRXMGHVr04DjYZV7rwdGo_fDmxVb36nMwgvd1hRoJNAWdYrFC3-mfESlyxHEcIpUk8t7WorahJbuAhziaB0OVD778Wekyme3naV5CtygLegWIYwjqsDw385Thge6QzLAzjWbYTG2DDsg19P-W0_-v8wZOxK5J_1PrFrrNZkvvuJVt0nu5PV-NG4IY
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ401VhvWjW2vjAx3IgUlteBmAAlqKVtbDG9NTx2tR6AFBr_vrsrtV70to9k9pHMzre7M98A3JHMklFGBlKsy0hCFkkkC5mxlDIwjmXLTAmLHQ7HehChp4W2aMHHNhaG84R-cnJEqlEp1fean9fl7hHL476V1X2yok3Fgz-3PbG5HdP7iyHroufYw-nEm7ii69rRTBy_2AOWYV7VTYce13sGY-dl0OnVYVEp5W-T4h_B_pRKy-tjaOG8Cx13m3mtCwdh8-FNi43uVSeguO-rUqg50GR0ivmb8J3-WYjzTKA4TohLTuS9qVhtjQtyCrf-cO4GEh18-bPSZTTbzVM9g3Ze5PgcBIohsEmyTM0SgrSBGaeKkco4RWpiKFiLe9D_W07_v84b6ATzcLQcPY6fL-CQ7SD3RdUvoV2vN_iKWtw6ueZb9QXK74UF
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Chip+transferring+method+and+the+apparatus+thereof&rft.inventor=Hsieh%2C+Min-Hsun&rft.inventor=Kuo%2C+De-Shan&rft.inventor=Yang%2C+Jhih-Yong&rft.inventor=Lee%2C+Chang-Lin&rft.date=2021-07-06&rft.externalDBID=B2&rft.externalDocID=US11056368B2