Isolation regions including two layers and method forming same
A method includes etching a semiconductor substrate to form trenches extending into the semiconductor substrate, and depositing a first dielectric layer into the trenches. The first dielectric layer fills lower portions of the trenches. A Ultra-Violet (UV) treatment is performed on the first dielect...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
08.06.2021
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Subjects | |
Online Access | Get full text |
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