Method of wire bonding a first and second circuit card

• Main Authors: Beninati, Gregory G, Tellinghuisen, Thomas J, Hersey, Donald G, Benedict, James E, Pevzner, Mikhail
• Format: Patent
• Language: English
• Published: 04.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card form...