Method of wire bonding a first and second circuit card
Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card form...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English |
| Published |
04.05.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire. |
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| AbstractList | Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire. |
| Author | Pevzner, Mikhail Hersey, Donald G Beninati, Gregory G Benedict, James E Tellinghuisen, Thomas J |
| Author_xml | – fullname: Beninati, Gregory G – fullname: Tellinghuisen, Thomas J – fullname: Hersey, Donald G – fullname: Benedict, James E – fullname: Pevzner, Mikhail |
| BookMark | eNrjYmDJy89L5WQw800tychPUchPUyjPLEpVSMrPS8nMS1dIVEjLLCouUUjMS1EoTk0GiiokZxYll2aWKCQnFqXwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDA0sgMLZwMjQmRg0AUKsu4A |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US10999938B1 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US10999938B13 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 14:41:22 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US10999938B13 |
| Notes | Application Number: US202016861326 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210504&DB=EPODOC&CC=US&NR=10999938B1 |
| ParticipantIDs | epo_espacenet_US10999938B1 |
| PublicationCentury | 2000 |
| PublicationDate | 20210504 |
| PublicationDateYYYYMMDD | 2021-05-04 |
| PublicationDate_xml | – month: 05 year: 2021 text: 20210504 day: 04 |
| PublicationDecade | 2020 |
| PublicationYear | 2021 |
| RelatedCompanies | Raytheon Company |
| RelatedCompanies_xml | – name: Raytheon Company |
| Score | 3.334622 |
| Snippet | Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Method of wire bonding a first and second circuit card |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210504&DB=EPODOC&locale=&CC=US&NR=10999938B1 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwGP0YU9Q3nYrOCxGkb0W2NWl9KEJvDKHbcKvsbaRJC91DO9YO_75fQud80beQQMiFk5OTfBeAZ2pLisJCmggd27QkH5g8t5jp8IEYKsoZcuWNHE_YOLHel3TZgfXeF0bHCf3SwRERUQLx3ujzenN4xAq0bWX9khZYVb1FCzcwWnWM-oXipgeeG86mwdQ3fN9N5sbkw1UfQEjFjodK6Qiv0bYy_wo_PeWVsvlNKdE5HM-wt7K5gE5W9uDU32de68FJ3H54Y7HFXn0JLNbJnkmVExVfmKSVdkghnOQFXuEILyWplbyVRBRbsSsaInD7r-ApChf-2MQBrH5mu0rmh7GOrqFbVmV2AwRplaa5kwnGEGc5e5VUOEOVLJzlVI7kLfT_7qf_X-MdnKmV01Z81j10m-0ue0CmbdJHvUTfxDCB_w |
| link.rule.ids | 230,309,783,888,25578,76884 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3PS8MwFH6MKc6bTsXNXxFktyLbmqweitB2peraDdfJbqNNWqiHdqwd_vu-hM550VtIICR5fPnyJXnvATzQkaAoLISG0Blpuoj6WpTqTDOiPh9IyhlE0hvZD5i30F-XdNmAz50vjIoT-qWCIyKiOOK9Uvv1en-J5ai_leVjnGFV8eyGptOr1THqF4pGdyxzPJs6U7tn2-Zi3gveTfkAhFRsWKiUDvCIbcg4--MPS3qlrH9TinsChzPsLa9OoZHkbWjZu8xrbTjy6wdvLNbYK8-A-SrZMylSIuMLk7hQDikkImmGRzgS5YKUUt4KwrMN32YV4Wj-c7h3x6HtaTiA1c9sV4v5fqzDC2jmRZ5cAkFapXFqJJwxxFnKngTlxkAmC2cpFUPRge7f_XT_a7yDlhf6k9XkJXi7gmO5iupHn34NzWqzTW6Qdav4Vi3XNwTNhO8 |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Method+of+wire+bonding+a+first+and+second+circuit+card&rft.inventor=Beninati%2C+Gregory+G&rft.inventor=Tellinghuisen%2C+Thomas+J&rft.inventor=Hersey%2C+Donald+G&rft.inventor=Benedict%2C+James+E&rft.inventor=Pevzner%2C+Mikhail&rft.date=2021-05-04&rft.externalDBID=B1&rft.externalDocID=US10999938B1 |