Cooling electronic devices in a data center
This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
30.03.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid. |
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| AbstractList | This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid. |
| Author | Padilla, Jorge Iyengar, Madhusudan Krishnan |
| Author_xml | – fullname: Iyengar, Madhusudan Krishnan – fullname: Padilla, Jorge |
| BookMark | eNrjYmDJy89L5WTQds7Pz8nMS1dIzUlNLinKz8tMVkhJLctMTi1WyMxTSFRISSxJVEhOzStJLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYlAZakl8aHBhgaWZmbGpkZORsbEqAEALaAq7Q |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US10966352B2 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US10966352B23 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 14:25:22 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US10966352B23 |
| Notes | Application Number: US201816139377 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210330&DB=EPODOC&CC=US&NR=10966352B2 |
| ParticipantIDs | epo_espacenet_US10966352B2 |
| PublicationCentury | 2000 |
| PublicationDate | 20210330 |
| PublicationDateYYYYMMDD | 2021-03-30 |
| PublicationDate_xml | – month: 03 year: 2021 text: 20210330 day: 30 |
| PublicationDecade | 2020 |
| PublicationYear | 2021 |
| RelatedCompanies | Google LLC |
| RelatedCompanies_xml | – name: Google LLC |
| Score | 3.3299184 |
| Snippet | This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Cooling electronic devices in a data center |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210330&DB=EPODOC&locale=&CC=US&NR=10966352B2 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMTZJMbRMsjTQTTQySdM1SUo0101Ms0gDFobAblyymYVZIvgyGF8_M49QE68I0wgmhizYXhjwOaHl4MMRgTkqGZjfS8DldQFiEMsFvLayWD8pEyiUb-8WYuuiBu0dA_svwP65mouTrWuAv4u_s5qzs21osJpfELCtawmqW42cgMU1K6gZDTpn3zXMCbQrpQC5SnETZGALAJqWVyLEwJSaJ8zA6Qy7eU2YgcMXOuENZELzXrEIAzDrgi7YSVdA3FyjkJIKzugKmXkKiQqgxZ4KoMWWqUWiDIpuriHOHrpAW-PhXowPDUY40FiMgQXY9U-VYFAwTgFdb25pmWyWbGmSkmZhkWKZDMyEoDP3DFMNjVMkGaRwmyOFT1KagQsUXODddQYyDCwlRaWpssDqtSRJDhwuAI7ffb4 |
| link.rule.ids | 230,309,786,891,25594,76904 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq6L1tYLkFmyamGYPQciLqE1abCK9hTw2Ug-xtBH_vrNLarzobdmF3ezCN7NfdmY-gFtVKxSa0aGcjrRS1rJ0LKelUaIxRBqX64aeCjGYINT9WHta3C868L7NhRF1Qr9EcUREVI54r4W9XrU_sRwRW7m5y5bY9fHgRaYjNewY-Qvyc8mxTHc2daa2ZNtmPJfCF7zrUu5bRxaa650xUkJeZ999tXhWyuq3S_EOYHeGs1X1IXRY1YeevVVe68Ne0Dx4Y7PB3uYIELpcYOeNtMo1pGAC6GRZkZTwYE_Cgy3Z-hhuPDeyfRlXTX62mMTz9gPVE-gi9WenQNSCy5tTmus51YrSMAqaIwh5zT2FKWpxBoO_5xn8N3gNPT8KJsnkMXw-h31-dCLTbngB3Xr9yS7R1dbZlTijb5ZkgKk |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Cooling+electronic+devices+in+a+data+center&rft.inventor=Iyengar%2C+Madhusudan+Krishnan&rft.inventor=Padilla%2C+Jorge&rft.date=2021-03-30&rft.externalDBID=B2&rft.externalDocID=US10966352B2 |