Light emitting device package and light emitting device package module
A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is mounted, a molding material that fills the cavity, and absorbing pigments that convert the light generated by the light emitting device. The ab...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
05.01.2021
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Subjects | |
Online Access | Get full text |
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Abstract | A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is mounted, a molding material that fills the cavity, and absorbing pigments that convert the light generated by the light emitting device. The absorbing pigments have a peak value within a wavelength range of 490 to 520 nm and a full width at half maximum (FWHM) of 40 to 70 nm. |
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AbstractList | A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is mounted, a molding material that fills the cavity, and absorbing pigments that convert the light generated by the light emitting device. The absorbing pigments have a peak value within a wavelength range of 490 to 520 nm and a full width at half maximum (FWHM) of 40 to 70 nm. |
Author | Lee, Ho Seop Shigeta, Tetsuya Cho, Seong-Phil Im, Sang Kyun |
Author_xml | – fullname: Im, Sang Kyun – fullname: Cho, Seong-Phil – fullname: Lee, Ho Seop – fullname: Shigeta, Tetsuya |
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Notes | Application Number: US201816100524 |
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RelatedCompanies | SAMSUNG ELECTRONICS CO., LTD |
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Snippet | A light emitting device package includes a light emitting device that generates light, a body frame including a cavity in which the light emitting device is... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Light emitting device package and light emitting device package module |
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