Method and device for embedding flash memory and logic integration in FinFET technology

Methods for preventing step-height difference of flash and logic gates in FinFET devices and related devices are provided. Embodiments include forming fins in flash and logic regions; recessing an oxide exposing an upper portion of the fins; forming an oxide liner over the upper portion in the flash...

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Main Authors Toh, Eng Huat, Zhu, Ming, Yeow, Su Yi Susan, Nga, Yiang Aun, Shum, Danny Pak-Chum, Li, Pinghui
Format Patent
LanguageEnglish
Published 11.08.2020
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Abstract Methods for preventing step-height difference of flash and logic gates in FinFET devices and related devices are provided. Embodiments include forming fins in flash and logic regions; recessing an oxide exposing an upper portion of the fins; forming an oxide liner over the upper portion in the flash region; forming a polysilicon gate over and perpendicular to the fins in both regions; removing the gate from the logic region and patterning the gate in the flash region forming a separate gate over each fin; forming an ONO layer over the gates in the flash region; forming a second polysilicon gate over and perpendicular to the fins in both regions; planarizing the second polysilicon gate exposing a portion of the ONO layer over the gates in the flash region; forming and patterning a hardmask, exposing STI regions between the flash and logic regions; and forming an ILD over the STI regions.
AbstractList Methods for preventing step-height difference of flash and logic gates in FinFET devices and related devices are provided. Embodiments include forming fins in flash and logic regions; recessing an oxide exposing an upper portion of the fins; forming an oxide liner over the upper portion in the flash region; forming a polysilicon gate over and perpendicular to the fins in both regions; removing the gate from the logic region and patterning the gate in the flash region forming a separate gate over each fin; forming an ONO layer over the gates in the flash region; forming a second polysilicon gate over and perpendicular to the fins in both regions; planarizing the second polysilicon gate exposing a portion of the ONO layer over the gates in the flash region; forming and patterning a hardmask, exposing STI regions between the flash and logic regions; and forming an ILD over the STI regions.
Author Li, Pinghui
Nga, Yiang Aun
Shum, Danny Pak-Chum
Toh, Eng Huat
Yeow, Su Yi Susan
Zhu, Ming
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Snippet Methods for preventing step-height difference of flash and logic gates in FinFET devices and related devices are provided. Embodiments include forming fins in...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Method and device for embedding flash memory and logic integration in FinFET technology
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