Conductive external connector structure and method of forming

• Main Authors: Chan, Chien-Pin, Cheng, Yung-Chiuan, Huang, Wei-Chih, Lin, Chi-Hung, Ku, Chin-Yu, Liu, Yuan-Fu, Huang, Chien-Ming, Liu, Chen-Hsun, Lo, Chun-Yen, Shih, Meng-Fu, Chen, Wen-Ming, Hsu, Yu-Nu, Huang, Cheng-Lin, Pang, Te-Hsun
• Format: Patent
• Language: English
• Published: 11.08.2020
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.