Electronic components having three-dimensional capacitors in a metallization stack
Disclosed herein are electronic components having three-dimensional capacitors disposed in a metallization stack, as well as related methods and devices. In some embodiments, for example, an electronic component may include: a metallization stack and a capacitor disposed in the metallization stack w...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
11.08.2020
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed herein are electronic components having three-dimensional capacitors disposed in a metallization stack, as well as related methods and devices. In some embodiments, for example, an electronic component may include: a metallization stack and a capacitor disposed in the metallization stack wherein the capacitor includes a first conductive plate having a plurality of recesses, and a second conductive plate having a plurality of projections, wherein individual projections of the plurality of projections extend into corresponding individual recesses of the plurality of recesses without contacting the first conductive plate. |
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Bibliography: | Application Number: US201615062143 |