Sapphire cover for electronic devices

• Main Authors: Memering, Dale N, Cai, Xiao Bing, Du, Xiang, Mylvaganam, Jeffrey C, Lee, Jong Kong, Kamei, Sawako, Chinnakaruppan, Palaniappan, Min, Feng, de Jong, Erik G, Zhang, Jing, Kamireddi, Srikanth, Liu, Sai Feng
• Format: Patent
• Language: English
• Published: 23.06.2020
• Subjects: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL; ANTENNAS, i.e. RADIO AERIALS; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CALCULATING; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPUTING; COUNTING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC DIGITAL DATA PROCESSING; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; HOROLOGY; MACHINE TOOLS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; MECHANICALLY-DRIVEN CLOCKS OR WATCHES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; POLISHING; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SOLDERING OR UNSOLDERING; SPRAYING OR ATOMISING IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.