MEMS microphone

A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a firs...

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Main Authors Kamijima, Akifumi, Inoue, Tohru
Format Patent
LanguageEnglish
Published 16.06.2020
Subjects
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PUBLIC ADDRESS SYSTEMS
TRANSPORTING
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Abstract A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.
AbstractList A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.
Author Inoue, Tohru
Kamijima, Akifumi
Author_xml – fullname: Kamijima, Akifumi
– fullname: Inoue, Tohru
BookMark eNrjYmDJy89L5WTg93X1DVbIzUwuyi_IAIrwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDAzMLc0MTSycjY2LUAAAgaSB2
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US10687149B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US10687149B23
IEDL.DBID EVB
IngestDate Fri Jul 19 15:54:34 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US10687149B23
Notes Application Number: US201916509628
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200616&DB=EPODOC&CC=US&NR=10687149B2
ParticipantIDs epo_espacenet_US10687149B2
PublicationCentury 2000
PublicationDate 20200616
PublicationDateYYYYMMDD 2020-06-16
PublicationDate_xml – month: 06
  year: 2020
  text: 20200616
  day: 16
PublicationDecade 2020
PublicationYear 2020
RelatedCompanies TDK CORPORATION
RelatedCompanies_xml – name: TDK CORPORATION
Score 3.2794924
Snippet A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion...
SourceID epo
SourceType Open Access Repository
SubjectTerms DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PUBLIC ADDRESS SYSTEMS
TRANSPORTING
Title MEMS microphone
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200616&DB=EPODOC&locale=&CC=US&NR=10687149B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSTEyTjJNtUjVtbBIMdE1SUsx0000SAGm5TRzYCPJ0szcJBE0DunrZ-YRauIVYRrBxJAF2wsDPie0HHw4IjBHJQPzewm4vC5ADGK5gNdWFusnZQKF8u3dQmxd1KC9Y1D_2NBMzcXJ1jXA38XfWc3Z2TY0WM0vCNjWNQN2DUwsnYDFNSuoGQ06Z981zAm0K6UAuUpxE2RgCwCallcixMCUmifMwOkMu3lNmIHDFzrhDWRC816xCAO_r6tvsEIuaAEdaD15qiiDoptriLOHLtDkeLg34kODEY4wFmNgAXbvUyUYFIyBTfy0JPM0UEPKJDHRzNLYBKgqNcU4zSQ11dgwUZJBCrc5UvgkpRm4QEECWthkaCbDwFJSVJoqC6xCS5LkwH4HAFR5c5w
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSTEyTjJNtUjVtbBIMdE1SUsx0000SAGm5TRzYCPJ0szcJBE0DunrZ-YRauIVYRrBxJAF2wsDPie0HHw4IjBHJQPzewm4vC5ADGK5gNdWFusnZQKF8u3dQmxd1KC9Y1D_2NBMzcXJ1jXA38XfWc3Z2TY0WM0vCNjWNQN2DUwsnYDFNas56HReUNMpzAm0K6UAuUpxE2RgCwCallcixMCUmifMwOkMu3lNmIHDFzrhDWRC816xCAO_r6tvsEIuaAEdaD15qiiDoptriLOHLtDkeLg34kODEY4wFmNgAXbvUyUYFIyBTfy0JPM0UEPKJDHRzNLYBKgqNcU4zSQ11dgwUZJBCrc5Uvgk5Rk4PUJ8feJ9PP28pRm4QMEDWuRkaCbDwFJSVJoqC6xOS5LkwOEAAOQRdok
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=MEMS+microphone&rft.inventor=Kamijima%2C+Akifumi&rft.inventor=Inoue%2C+Tohru&rft.date=2020-06-16&rft.externalDBID=B2&rft.externalDocID=US10687149B2