High-density interconnecting adhesive tape

• Main Authors: Horibe, Akihiro, Okamoto, Keishi, Mori, Hiroyuki
• Format: Patent
• Language: English
• Published: 14.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A technique for interconnecting chips by using an interconnection substrate is disclosed. The interconnection substrate includes a base substrate, a first group of electrodes on the base substrate for a first chip to be mounted, and a second group of electrodes on the base substrate for a second chi...