Printed wiring board, crack prediction device, and crack prediction method

A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less th...

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Main Authors Nakamura, Naoki, Mukoyama, Takahide, Iriguchi, Shigeo, Hatanaka, Kiyoyuki, Sugino, Shigeru, Kanai, Ryo, Taketomi, Nobuo
Format Patent
LanguageEnglish
Published 31.03.2020
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Abstract A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole.
AbstractList A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole.
Author Sugino, Shigeru
Iriguchi, Shigeo
Mukoyama, Takahide
Kanai, Ryo
Hatanaka, Kiyoyuki
Nakamura, Naoki
Taketomi, Nobuo
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– fullname: Mukoyama, Takahide
– fullname: Iriguchi, Shigeo
– fullname: Hatanaka, Kiyoyuki
– fullname: Sugino, Shigeru
– fullname: Kanai, Ryo
– fullname: Taketomi, Nobuo
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Snippet A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two...
SourceID epo
SourceType Open Access Repository
SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
TESTING
Title Printed wiring board, crack prediction device, and crack prediction method
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