Micro-electrical mechanical system sensor package and method of manufacture thereof
A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall;...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
17.03.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!