Packaged die stacks with stacked capacitors and methods of assembling same
A stacked-die and stacked-capacitor package vertically arranged capacitors to mirror a semiconductive-device stack. The stacked capacitor can be electrically coupled to one or more semiconductive devices in the stacked architecture.
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
17.03.2020
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Subjects | |
Online Access | Get full text |
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