Cooling system for use with a power electronics assembly and method of manufacturing thereof

• Main Author: Kusuda, Charles E
• Format: Patent
• Language: English
• Published: 03.03.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMBINED OPERATIONS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING; UNIVERSAL MACHINE TOOLS

A cooling system for use with a power electronics assembly comprising an array of line-replaceable units is provided. The cooling system includes a first manifold coupled in flow communication with the array of line-replaceable units, and a fluid supply coupled in flow communication with the first m...