Module for heat generating electronic component
A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissip...
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Main Author | |
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Format | Patent |
Language | English |
Published |
14.01.2020
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Subjects | |
Online Access | Get full text |
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