Module for heat generating electronic component
A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissip...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
14.01.2020
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissipation section 4a that is provided so that a part thereof is exposed to a side surface of the wiring substrate 2. In this case, because the heat dissipation section 4a is provided so that a part thereof is exposed to the side surface of the wiring substrate 2, the heat from the electronic component 3a can be dissipated through the side surface of the wiring substrate 2. |
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| AbstractList | A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissipation section 4a that is provided so that a part thereof is exposed to a side surface of the wiring substrate 2. In this case, because the heat dissipation section 4a is provided so that a part thereof is exposed to the side surface of the wiring substrate 2, the heat from the electronic component 3a can be dissipated through the side surface of the wiring substrate 2. |
| Author | Fujinaga, Kentaro |
| Author_xml | – fullname: Fujinaga, Kentaro |
| BookMark | eNrjYmDJy89L5WTQ981PKc1JVUjLL1LISE0sUUhPzUstSizJzEtXSM1JTS4pys_LTFZIzs8tAKrPK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJQP0l8aHBhgamxqamFoZORsbEqAEAOEwtDg |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US10535581B2 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US10535581B23 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 15:15:34 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US10535581B23 |
| Notes | Application Number: US201715598593 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200114&DB=EPODOC&CC=US&NR=10535581B2 |
| ParticipantIDs | epo_espacenet_US10535581B2 |
| PublicationCentury | 2000 |
| PublicationDate | 20200114 |
| PublicationDateYYYYMMDD | 2020-01-14 |
| PublicationDate_xml | – month: 01 year: 2020 text: 20200114 day: 14 |
| PublicationDecade | 2020 |
| PublicationYear | 2020 |
| RelatedCompanies | Murata Manufacturing Co., Ltd |
| RelatedCompanies_xml | – name: Murata Manufacturing Co., Ltd |
| Score | 3.2515488 |
| Snippet | A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Module for heat generating electronic component |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200114&DB=EPODOC&locale=&CC=US&NR=10535581B2 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fS8MwED7GFN2bTkXnDyJI38pom8y9FKFpyxC6DbfK3saSpuKQdrgO_30vobO-6Ftp4dIc3N13yd13AA9MIUaVmKaKnFKbDlfSFlSgXeVupuTKo5TqbuRkPBil9HnBFi1Y73thDE_olyFHRIuSaO-V8deb5hArNLWV2754x1flUzz3Q6vOjl3TG2qFgR9NJ-GEW5z76cwavyDWZZpI3AnQXR9oGK159qPXQHelbH6HlPgEDqcorahOoaWKLhzz_eS1Lhwl9YU3Pta2tz2DflJmuw9FEGUS7UHJm2GM1mXLpBlmQ3SNeFmg4HO4j6M5H9m48vJnm8t01vykdwFtTP_VJRCH5c4AkUmOoRS1yIQrxWPmehlTCAUEu4Le33J6_328ho5WmT5QcOgNtKvPnbrFEFuJO6Obb5SNgCI |
| link.rule.ids | 230,309,786,891,25594,76903 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ401VhvWjVaX2tiuJEGutt6ISZACWqhjQXTG-nCYjQGGkvj33d2Q8WL3ggks-wkM_N9u_MAuGUCMWqKNJXnlOr0bpnqnHK0q9zMRLocUEplNXIQDv2YPi7YogXv21oY1Sf0SzVHRItK0d4r5a9XzSGWq3Ir133-hq_Key-yXK1mx6aqDdVc2xrPpu7U0RzHiuda-IxYl8lG4oaN7npnhJRQUaUXW1alrH6HFO8AdmcoragOoSWKLnSc7eS1LuwF9YU3Pta2tz6CflBmmw9BEGUS6UHJq-oYLdOWSTPMhsgc8bJAwcdw440jx9dx5eRnm0k8b35ycAJtpP_iFIjBcmOIyCTHUIpaZNxM-SgzBxkTCAU4O4Pe33J6_328ho4fBZNk8hA-ncO-VJ88XDDoBbSrz424xHBb8Sulp2-3o4MM |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Module+for+heat+generating+electronic+component&rft.inventor=Fujinaga%2C+Kentaro&rft.date=2020-01-14&rft.externalDBID=B2&rft.externalDocID=US10535581B2 |