Molded chip combination
Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnect...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English |
| Published |
17.12.2019
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip. |
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| AbstractList | Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip. |
| Author | Barber, Ivor Fu, Lei Bhagavat, Milind S Leong, Chia-Ken Agarwal, Rahul |
| Author_xml | – fullname: Fu, Lei – fullname: Barber, Ivor – fullname: Leong, Chia-Ken – fullname: Agarwal, Rahul – fullname: Bhagavat, Milind S |
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| Notes | Application Number: US201715675214 |
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| PublicationYear | 2019 |
| RelatedCompanies | Advanced Micro Devices, Inc Agarwal Rahul Leong Chia-Ken Fu Lei Bhagavat Milind S Barber Ivor |
| RelatedCompanies_xml | – name: Barber Ivor – name: Bhagavat Milind S – name: Agarwal Rahul – name: Advanced Micro Devices, Inc – name: Fu Lei – name: Leong Chia-Ken |
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| Snippet | Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Molded chip combination |
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