Carrier-bonding methods and articles for semiconductor and interposer processing

• Main Authors: Keech, John Tyler, Shorey, Aric Bruce, Thomas, III, Windsor Pipes, Enicks, Darwin Gene
• Format: Patent
• Language: English
• Published: 17.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A thin sheet (20) disposed on a carrier (10) via a surface modification layer (30) to form an article (2), wherein the article may be subjected to high temperature processing, as in FEOL semiconductor processing, not outgas and have the thin sheet maintained on the carrier without separation therefr...