Modifying substrate thickness profiles

• Main Authors: Wang, Zhihong, Zhang, Jimin, Tu, Wen-Chiang
• Format: Patent
• Language: English
• Published: 05.11.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

Before a first surface of a substrate is polished using a chemical mechanical process, the substrate is transferred to a modification station. The substrate comprises a side wall connected with the first surface at an edge and a second surface opposite to the first surface and also connected to the...