Film product, film packages and package modules using the same

• Main Authors: Kim, Woonbae, Ha, Jeong-Kyu, Chung, Yechung, Lim, Soyoung
• Format: Patent
• Language: English
• Published: 28.05.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the...