Substrate features for inductive monitoring of conductive trench depth

• Main Authors: Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, McClintock, William H, Swedek, Boguslaw A, Redeker, Fred C, Tu, Wen-Chiang
• Format: Patent
• Language: English
• Published: 05.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenc...