Substrate features for inductive monitoring of conductive trench depth

A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenc...

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Bibliographic Details
Main Authors Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, McClintock, William H, Swedek, Boguslaw A, Redeker, Fred C, Tu, Wen-Chiang
Format Patent
LanguageEnglish
Published 05.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.
Bibliography:Application Number: US201815891290